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XMCERA | Aluminum Nitride Components
Why AlN Ceramic
Aluminum nitride has good thermal conductivity and thermal shock resistance, as well as good insulation. Because of liquid phase sintering and no second phase at the grain boundary, the crystal structure is very dense and has good resistance to plasma corrosion.
 Low Thermal Expansion |
 High Thermal Conductivity |
 High Electrical Insulation |
AlN Ceramic Properties
| Properties | Units | Value |
| Color | / | Grey |
| Density | g/cm³ | 3.31 |
| Modulus of Elasticity | GPa | 310 |
| Fracture toughness | MPa*m½ | 3.5 |
| Compressive Strength | MPa | 2100 |
| Flexural Strength | MPa | 335 |
| Hardness (Knoop 100 g) | Kg/mm² | 1170 |
| Hardness (Vickers) | GPa | 11 |
| Oxidizing | ℃ | 700 |
| Inert | ℃ | 1300 |
| @ 25°C | W/mK | 180 |
| @ 300°C | W/mK | 130 |
| Specific Heat | J/kg.K | 750 |
| Thermal Shock Resistance ΔT | °C | 400 |
| CTE 25°C ➞ 100°C | 10ˉ⁶/°C | 3.6 |
| CTE 25°C ➞ 300°C | 10ˉ⁶/°C | 4.6 |
| CTE 25°C ➞ 500°C | 10ˉ⁶/°C | 5.2 |
| CTE 25°C ➞ 1000°C | 10ˉ⁶/°C | 5.6 |
| Dielectric Constant | 1 MHz | 8.6 |
| Loss Tangent | 1 MHz | 5*10ˉ⁴ |
| Dielectric Strength | kV/mm | >15 |
| 25°C | Ω cm | >10¹³ |
| 300°C | Ω cm | 10⁹ |
| 500°C | Ω cm | 10⁷ |
Main Application
▪ Insulator Part
▪ LCD Spare Part
▪ Ceramic Substrate
▪ Thermal Insulation Filling Material
Based on our customers’ requirements for aluminum nitride components, we combine the most suitable process with our commitment to our customers to ensure that our material solutions meet demanding specifications while delivering superior performance.
