XMCERA | Aluminum Nitride Components

Why AlN Ceramic

Aluminum nitride has good thermal conductivity and thermal shock resistance, as well as good insulation. Because of liquid phase sintering and no second phase at the grain boundary, the crystal structure is very dense and has good resistance to plasma corrosion.

Low thermal expansion Low Thermal Expansion Higher thermal conductivity High Thermal Conductivity Electrical insulation High Electrical Insulation

AlN Ceramic Properties

Properties Units Value
Color / Grey
Density g/cm³ 3.31
Modulus of Elasticity GPa 310
Fracture toughness MPa*m½ 3.5
Compressive Strength MPa 2100
Flexural Strength MPa 335
Hardness (Knoop 100 g) Kg/mm² 1170
Hardness (Vickers) GPa 11
Oxidizing 700
Inert 1300
@ 25°C W/mK 180
@ 300°C W/mK 130
Specific Heat J/kg.K 750
Thermal Shock Resistance ΔT °C 400
CTE 25°C ➞ 100°C 10ˉ⁶/°C 3.6
CTE 25°C ➞ 300°C 10ˉ⁶/°C 4.6
CTE 25°C ➞ 500°C 10ˉ⁶/°C 5.2
CTE 25°C ➞ 1000°C 10ˉ⁶/°C 5.6
Dielectric Constant 1 MHz 8.6
Loss Tangent 1 MHz 5*10ˉ⁴
Dielectric Strength kV/mm >15
25°C Ω cm >10¹³
300°C Ω cm 10⁹
500°C Ω cm 10⁷

Main Application

▪ Insulator Part

▪ LCD Spare Part

▪ Ceramic Substrate

▪ Thermal Insulation Filling Material

Based on our customers’ requirements for aluminum nitride components, we combine the most suitable process with our commitment to our customers to ensure that our material solutions meet demanding specifications while delivering superior performance.