XMCERA | AlN Substrate
▼ AlN Substrate
Aluminum nitride ceramic substrate is made of aluminum nitride ceramic as the main raw material. As a new type of ceramic substrate, aluminum nitride ceramic substrate has the characteristics of high thermal conductivity, good mechanical properties, corrosion resistance, excellent electrical properties, welding and so on. It is an ideal cooling substrate and packaging material for large-scale integrated circuits. In recent years, with the rapid development of electronic information industry, the market performance requirements for ceramic substrates continue to increase. With its excellent characteristics, the application range of aluminum nitride ceramic substrates continues to expand.
|corrosion resistance||high thermal conductivity|
|good mechanical properties||excellent electrical properties|
▼ Preparation Technology
• ball mill pulping
In the preparation of aluminum nitride slurry, organic mixed solvents such as dispersants, binders, plasticizers, etc. are usually added to obtain slurry properties that are easy to flow casting. In addition, Y2O3 is generally added to act as a sintering aid under normal pressure sintering conditions. The viscosity of the slurry has a significant impact on the properties of the substrate. The factors that affect the viscosity of the slurry are the grinding time, the amount of organic mixed solvent, the amount of dispersant, binder, plasticizer and so on. Therefore, the formula selection and process control of the slurry have a significant impact on the performance of the ceramic substrate.
• tape casting
Tape casting has high production efficiency, is easy to realize continuous production and automation, reduces costs, and realizes mass production. The thickness of the produced substrate can be as thin as less than 10µm and as thick as more than 1mm. Tape casting is an important step in the transformation of AlN aluminum nitride ceramic substrates to practical use, and has important application prospects.
The substrate green body produced by tape casting method contains a large amount of organic matter, its internal porosity is large, and its strength is low. If it is directly sintered, it will cause strong shrinkage of the substrate, and the substrate will warp. Sintering will also lead to mutual bonding of the green sheets, affecting the yield and thermal conductivity of the substrate. In order to prevent the occurrence of the above defects, sintering after pre-firing in a nitrogen atmosphere furnace at 1100°C can improve the strength of the green body, reduce the porosity, and obtain an AlN substrate material with high flatness and good performance.
After debinding, the aluminum nitride substrate will be sintered at high temperature. The sintering process of high thermal conductivity aluminum nitride substrate mainly includes sintering method, addition of sintering aids, control of sintering atmosphere, etc.
Automotive electronics, semiconductor refrigeration devices, LED lighting, power resistors.