Aluminum Nitride
Ceramic Material with Very High Thermal Conductivity
Aluminum Nitride Ceramics
Aluminum nitride (AlN) is a fine ceramic material that features an extremely interesting combination of very high thermal conductivity and excellent electrical insulation properties.
ALN90 | ALN170 | |||
---|---|---|---|---|
General properties | Characteristics | High purity | High thermal conductivity | |
Main component purity (wt%) | 99.5 | 94 | ||
Color | Black | Light gray | ||
Density (g/cm3) | 3.24 | 3.31 | ||
Water absorption (%) | 0 | 0 | ||
Mechanical properties | Bending strength (MPa) | 295 | 345 | |
Young’s modulus (GPa) | 320 | 320 | ||
Vickers hardness (GPa) | 11 | 11 | ||
Thermal properties | Max. operating temperature (°C) | 1000 | 1000 | |
Coefficient of thermal expansion (1/°C×10-6) | RT~500°C | 4.4 | 4.4 | |
RT~800°C | 5.1 | 5.1 | ||
Coefficient of thermal conductivity (W/m×K) | 90 | 170 | ||
Thermal shock resistance ΔT (°C) | 300 | 400 | ||
Electrical properties | Volume resistivity | 25°C | 1014 | 1014 |
300°C | 108 | 1010 | ||
500°C | 107 | 107 | ||
800°C | 105 | 105 | ||
Dielectric constant | 10GHz | 8.5 | 8.5 | |
Dielectric loss (×10-4) | 30 | 30 | ||
Q factor (×104) | 0.03 | 0.03 | ||
Dielectric breakdown voltage (KV/mm) | – | – |
- Properties of Aluminum Nitride (AlN)
High thermal conductivity
High electrical insulation capacity
Low thermal expansion
Thermal stability and shock resistance
Plasma corrosion resistance
Good metallization capacity - Applications of Aluminum Nitride
Semiconductor manufacturing equipment components
Electronic substrates
Heater components
Transportation components
High power insulators
Laser components
Water cooled heatsinks
Power electronics
Heat sinks
Heat spreaders
Laser heatsinks power rectifiers - Shape of Aluminum Nitride
Plate, bar, pipe, crucible, complex design, We can produce in any shapes.
Large size up to Diameter 600mm is available.